Application of IGBT radiator

In order to select IGBT radiator, two factors are considered as prerequisites.

1. Thermal resistance, thermal resistance is an important index to measure the radiator heat dissipation capacity. The key point of thermal design is to calculate the thermal resistance of the radiator. When selecting, the cooling mode should be determined according to the power consumption of the original device. The range of the parameters can be chosen by referring to the following figure. IGBT heat pipe radiator

2. Cooling mode, cooling can ensure the stability of thermal resistance, which mode is more appropriate, structure, reliable operation and cost are the key points to consider. Each mode has its advantages and disadvantages. The following figure is based on power consumption as a parameter, and the range can be determined for reference.

Characteristics of IGBT Module Air-cooled Radiator

The characteristics of air-cooled radiator are high heat dissipation efficiency, low cost, high reliability, simple structure and convenient maintenance. The traditional air-cooled radiator has been subject to the level of technology, mould and processing ability of the radiator, which makes the heat dissipation capacity not develop rapidly. Its application is only suitable for the case of small heat dissipation power and large heat dissipation space. Even so, air-cooled radiators are widely used in power electronic devices.

With the rapid development of power electronics technology and the increasing requirements of electronic equipment for high performance, high reliability and high power components, the heat dissipation per unit volume is getting higher and higher, resulting in a sharp rise in calorific value and temperature. As thermal drive causes more and more serious mechanical, chemical and electrical problems, which seriously restricts the quality and reliability of products, heat dissipation of high-power components (IGBT modules) has become a hot topic in the field of power electronics applications.

Heat Dissipation Scheme of High Power Electronic Devices (IGBT Modular Radiator)

In the thermal design of electronic components, the choice of heat dissipation mode and its experiment, simulation, analysis and optimization to obtain a structure with high thermal efficiency and low cost are particularly important to ensure that the internal junction temperature of power devices remains within the allowable range.

High-power radiators have different working environment and temperature changes on electronic components when air-cooled. The relative temperature of the inlet side is lower, the wind speed is higher, the temperature of the outlet side is higher and the wind speed is lower. For the two electronic components on the same substrate, the temperature on the outlet side is higher.